EP30-2 Epoxy System

Description

EP30-2 is a two-component, low-viscosity epoxy system from Master Bond that cures at room temperature. Application of heat can be used to accelerate the curing process. It is mixed at a 10:1 weight ratio of resin to hardener. This formulation is designed to exhibit minimal shrinkage upon curing, promoting excellent dimensional stability in bonded components. The cured epoxy forms strong, resilient bonds that are resistant to thermal cycling and exposure to chemicals such as water, oils, and many organic solvents. Its operational temperature range is exceptionally broad, from 4 Kelvin up to 300°F (approximately 149°C). It adheres effectively to substrates including metals, glass, ceramics, rubbers, and plastics, while offering electrical insulation and optical clarity. The system complies with NASA low outgassing specifications and is utilized in aerospace, electronics, optical device assembly, and OEM manufacturing. It is available for purchase in half-pint, pint, quart, gallon, and gun kits for bonding, sealing, coating, and encapsulation purposes.