EP21TCHT-1 Epoxy Compound

Description

Master Bond EP21TCHT-1 is a two-part, thixotropic paste epoxy formulated for bonding and sealing applications requiring thermal conductivity and high-temperature endurance. The system cures at ambient temperatures or with heat acceleration, using a mix ratio by weight of 100 parts resin to 60 parts hardener. Once cured, the material exhibits high strength and toughness, maintaining performance across an extreme temperature range from 4 K to 400°F (approximately 204°C). It demonstrates resistance to thermal shock, moisture, fuels, and a variety of solvents. The adhesive bonds effectively to metals, ceramics, glass, and many plastics and elastomers. Notably, it combines high thermal conductivity with electrical insulating properties and a low coefficient of thermal expansion. The compound meets NASA low outgassing specifications and MIL-STD-810G requirements for fungal resistance, and it withstands long-term exposure to 85°C and 85% relative humidity. These properties make it applicable in demanding sectors such as aerospace, electronics, and chemical processing, particularly for assemblies in high-vacuum environments where high-temperature curing is impractical. It is supplied in several package sizes including half-pint, pint, quart, and gallon kits, as well as in premixed and frozen syringe formats.