Crystal Orientation Wafer XRD 300 - Automated Wafer Quality Control

Description

The Wafer XRD 300 is an automated X-ray diffraction module configured for the quality control inspection of 300 mm wafers within semiconductor manufacturing. It performs rapid, multi-parameter assessment of each wafer, with typical measurement times lasting only a few seconds. Crystal orientation is determined using a proprietary rotational scan method, providing tilt precision better than 0.003 degrees. Beyond orientation, the system measures geometric characteristics vital for downstream processing, such as notch position, depth, and opening angle; flat position and length; and wafer diameter. Designed for complete automation, the module integrates directly with wafer handling and sorting systems to sustain high throughput levels of over 10,000 wafers per month. Integration into new or established fabrication lines is facilitated by compatibility with MES and SECS/GEM communication interfaces. The instrument supports analysis of a range of common semiconductor and substrate materials, such as silicon, silicon carbide, aluminum nitride, sapphire, gallium arsenide, quartz, and lithium niobate.