Crystal Orientation Wafer XRD 200 - Automated Wafer Quality Control

Description

Engineered for high-volume quality assessment, the Wafer XRD 200 is an automated X-ray diffraction platform for wafer production and research. It is built to execute several measurements on a single wafer within seconds. Measured parameters encompass crystal orientation, resistivity, and key geometric attributes like notch position and depth, flat position and length, and overall wafer diameter. For orientation analysis, the system uses a scanning technique that needs only one rotation of the wafer to collect data, typically achieving a tilt measurement precision finer than 0.003 degrees for materials such as silicon. The platform is fully automated, incorporating wafer handling, sorting, and data transfer functions to support monthly throughputs exceeding 10,000 wafers. It connects to process lines via standard industrial interfaces, including MES and SECS/GEM protocols. The Wafer XRD 200 can analyze various wafer substrate materials, including silicon, silicon carbide, aluminum nitride, sapphire, gallium arsenide, quartz, and lithium niobate.